NeXpectrum Co.,LTD, (ÁÖ)³Ø½ºÆåÆ®·³, Laser Diode(LD),
Laser Source(YVO4), Laser Galvano Scanner, Marking Head Laser,
Marking System, ·¹ÀÌÀú¼Ò½º, ·¹ÀÌÀú ´ÙÀÌ¿Àµå, ·¹ÀÌÀú °¥¹Ù³ë ½ºÄ³³Ê,
·¹ÀÌÀú¸¶Å·, ·¹ÀÌÀú¸¶Å·½Ã½ºÅÛ ·¹ÀÌÀúÄ¿ÆÃ, ·¹ÀÌÀúÄ¿ÆÃ½Ã½ºÅÛ, CO2 ·¹ÀÌÀú,
CO2 Laser, 3D ·¹ÀÌÀú 3D Laser Marking, Fly Marking ,Marking on the Fly,
RP(Rapid Prototype) System, Green Laser, Blue Laser, ±×¸°·¹ÀÌÀú, ºí·ç·¹ÀÌÀú,
1064nm, 808nm, Laser Marking, ÁÖ¹®Á¦ÀÛ ·¹ÀÌÀú, ·¹ÀÌÀú ¼³°è, ·¹ÀÌÀú Á¦ÀÛ,
¸ÖƼÇìµå ·¹ÀÌÀú, Multi Head Laser, Multi Source Laser, ·¹ÀÌÀú ÄÁÆ®·Ñ·¯,
Laser Controller,»ê¾÷¿ë ·¹ÀÌÀú, ¸¶Å·, Ä¿ÆÃ, Marking, Cutting, Rotary Marking,
ȸÀü¸¶Å·, ·ÎŸ¸®¸¶Å·, ÀÚµ¿¸¶Å·, Auto Marking, Automation Laser,
ÀÚµ¿ ·¹ÀÌÀú, ·¹ÀÌÀúÁ¶°¢, Nano °¡°ø±â, ÃʼÒÇü±ÝÇü°¡°ø, 3D ±ÝÇü°¡°ø, Split Marking,
ºÐÇÒ¸¶Å·, Æò¸éºÐÇÒ¸¶Å·, ȸÀüºÐÇÒ¸¶Å·, ´«±Ý¸¶Å·, ¿øÇü¸¶Å·, Globe Marking,
À¯¸®¸¶Å·, ¼¼¶ó¹Í ¸¶Å·, ¹ÝµµÃ¼ ¸¶Å·, Micro Machining, ¸¶ÀÌÅ©·Î°¡°ø, ³ª³ë°¡°ø,
10W ·¹ÀÌÀú, YVO4 ·¹ÀÌÀú, YAG ·¹ÀÌÀú, Lamp ·¹ÀÌÀú, ·¹ÀÌÀú¸¶Å·±â, ·¹ÀÌÀúÄ¿ÆÃ±â,
¾Ë·ç¹Ì´½ ¸¶Å·, ½ºÅÙ ¸¶Å·, ÇÃ¶ó½ºÆ½ ¸¶Å·, °í¹«°¡°ø, °í¹«Á¶°¢, °í¹« ÆÄ³»±â,
ÀÓÇöõÆ® ¸¶Å·, 3D ¸¶Å·, Rubber Marking, Rubber Engraving, Laser Engraving,
CO2 Ä¿ÆÃ±â, YAG ¸¶Å·±â, CO2 ¸¶Å·±â, ·¹ÀÌÀú RP, RP ·¹ÀÌÀú, ¿å½Ç ¾Ç¼¼»ç¸® ¸¶Å·,
·Î°í¸¶Å·, Á¦Ç°¸¶Å·, »çÁø¸¶Å·, ±Í±Ý¼Ó ±ÛÀÚ »õ±â±â, ¼öÀÔ·¹ÀÌÀú A/S, ¼öÀÔ·¹ÀÌÀú ¾÷±×·¹À̵å,
¼öÀÔ·¹ÀÌÀú Upgrade, »ý»ê¶óÀÎ ·¹ÀÌÀú, ¸ÂÃãÇü ·¹ÀÌÀú, ·¹ÀÌÀú±â°è, ·¹ÀÌÀú ±â°è,
Laser Machine, ¸¶Å·±â°è, Marking Machine, ·¹ÀÌÀú±â¼ú, Laser Technology, ·¹ÀÌÀú ÁÖº¯±â±â,
·¹ÀÌÀú ÀÀ¿ë, Laser Application, ·¹ÀÌÀú ¾îÇø®ÄÉÀ̼Ç, ·¹ÀÌÀú ÀÀ¿ëºÐ¾ß, LD,
´ÙÀ̾Ƹóµå¸¶Å·, Diamond ¸¶Å·, ½Å¼ÒÀç ¸¶Å·, ·¹ÀÌÀú ÀÚµ¿±â±â, ·¹ÀÌÀú±â±â,
·¹ÀÌÀú¸¶Å·±â±â, ·¹ÀÌÀú ÁõÆø±â, ·¹ÀÌÀú ¼ö¸®, ·¹ÀÌÀú °³Á¶, ·¹ÀÌÀú ÆÇ¸Å, ·¹ÀÌÀú ¸¶Å·±â ÆÇ¸Å,
½Å°³³ä ¸¶Å·±â, ½Å¼ÒÀç ¸¶Å·±â, ¼¼¶ó¹Í ¸¶Å·, Glass Marking, ÇÚµåÆù ŰÆÐµå ¸¶Å·,
ÇÚµåÆù ŰÆÐµå ·¹ÀÌÀú ¸¶Å·, Handphone keypad Laser Marking, ºÎǰ ¸¶Å·, ¼è ¸¶Å·,
Steel Marking, ³¯Â¥¸¶Å·, Á¦Á¶³¯Â¥ ¸¶Å·, Date Marking, ÇöóÀ̸¶Å·, ÇöóÀÌ ¸¶Å·,
Fly Marking, ·¹ÀÌÀú °¡°ø±â, ·¹ÀÌÀú Á¶°¢±â, ¹ÙÄÚµå ¸¶Å·, Barcode Marking,
2D ¹ÙÄÚµå ¸¶Å·, 2D Barcode Marking, ·¹ÀÌÀú ¼Ò½º, ÃʼÒÇü °¡°ø, ÃʼÒÇü ¸¶Å·,
´ëÇü¸¶Å· ´ëÇü ¸¶Å·, Nano Marking, Micro Marking, ¸¶ÀÌÅ©·Î ¸¶Å·, ·¹ÀÌÀú ÀÓ°¡°ø,
¹ÝÁö ¸¶Å·, ÀÚµ¿ xÃà yÃà zÃà ¸¶Å·, ÀÚµ¿ ¸¶Å·, ¸¶Å· Å×À̺í, Marking Table,
Laser Working Table, ÇÇ´õ ¸¶Å·, ·¹ÀÌÀú µ¿¿µ»ó, ·¹ÀÌÀú¸¶Å· µ¿¿µ»ó, ·¹ÀÌÀú¸¶Å· »ùÇÃ,
·¹ÀÌÀú¸¶Å· Sample, Laser Marking Sample, ±Û¾¾ »õ±â±â, ·Î°í »õ±â±â, ·Î°í ¸¶Å·,
·¹ÀÌÀú, Laser, YVO4 Laser Machine, YVO4 ·¹ÀÌÀú ±â°è, YVO4 ¸¶Å·±â, YVO4 ·¹ÀÌÀú ¸¶Å·±â,
YVO4 ·¹ÀÌÀú±â±â, ¹ÝµµÃ¼ ·¹ÀÌÀú, Semiconductor Laser, DPSS(Diode Pumping Semiconductor Source),
ÀÚµ¿ ·¹ÀÌÀú, ·ÎŸ¸® ¸¶Å·, ȸÀü ¸¶Å·, ´«±Ý ¸¶Å·, ¿øÇü ¸¶Å·, ¹ÝÁö ¸¶Å·, À¯¸® ¸¶Å·, ¼¼¶ó¹Í¸¶Å·,
³ª³ë °¡°ø, ¸¶ÀÌÅ©·Î °¡°ø.